|(1) A counterfeit indicator. (2)Defects related to the interior structure of a device. (e.g. bond wires, die, etc.)
See: Physical Defect, Exterior Defect
Note: “Interior defects are mainly divided into two types: bond wire and die-related defects. Some common defects related to bond wires are missing/broken bond wires inside the package, a poor connection between the die and bond wire, etc. The die reveals a significant amount of relevant information regarding the component. Die-related defects include die markings, cracks, etc.”"
|Source: “Counterfeit Integrated Circuits: Detection, Avoidance, and the Challenges Ahead” by Ujjwal Guin, Daniel DiMase and Mohammad Tehranipoor