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Applied to surface-mount semiconductor devices and is the plane formed by the three terminal apexes that exhibit the greatest perpendicular distance from the package substrate, provided that the triangle formed by those three apexes encompasses the projection of the center of gravity (COG) of the component.
Source: IDEA Standard IDEA-STD-1010-B Acceptability of Electronic Components Distributed in the Open Market, Rev. B and JEDEX, JESD22-B108B: Coplanarity Test for Surface-Mount Semiconductor Devices