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R
Repackaging


Repackaging is the process of altering the packaging of a part in order to disguise it as a different part with a different pin count and package type (e.g., dual-in-line (DIP) or plastic leaded chip carrier (PLCC)). The process involves recovery of die (by removing the original packaging) and molding the die into the desired package type. Counterfeiters generally do not use proper handling procedures, tools, and materials for repackaging the die, which may lead to defects or degradation in the repackaged parts such as die contamination, moisture-induced interfacial delamination, and cracks in the passivation layer. There may also be workmanship issues with the repackaged parts such as missing bond wires, missing die, bond wire misalignment, or poor die paddle construction. The marking on repackaged parts also may not match with the die markings. There may also be marking irregularities such as spelling errors, discrepancies in part number, or an incorrect logo. Counterfeiters may also use inferior quality materials to package the die, such as cheap filler materials and flame retardants.
Source: “Screening for Counterfeit Electronic Parts” by Bhanu Sood and Diganta Das – Center for Advanced Life Cycle Engineering.