Search Reported Parts

Search Companies

Search Member Inventories

Glossary

 



Glossary Index

A | B | C | D | E | F | G | H | I | J | K | L | M | N | O | P | Q | R | S | T | U | V | W | X | Y | Z | ALL


S
Solderability Testing


The purpose of this test method is to provide a means of determining the solderability of device package terminations that are intended to be joined to another surface using lead- (Pb-) containing or Pb-free solder for the attachment.
Source: JEDEC Standard, JESD22-B102E: Solderability.